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LTC3250 Datasheet(PDF) 6 Page - Linear Technology |
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LTC3250 Datasheet(HTML) 6 Page - Linear Technology |
6 / 12 page LTC3261 6 3261f BLOCK DIAGRAM CHARGE PUMP AND INPUT LOGIC 50kHz TO 500kHz OSC VIN VOUT S1 S4 S3 2 13 GND 3261 BD 5 C+ C– 8 9 4 10 EN MODE RT 11 S2 PIN FUNCTIONS NC (Pins 1, 3, 6, 7,12): No Connect Pins. These pins are not connected to the LTC3261 die. These pins should be left floating or connected to ground. Pins 6 and 7 can also be shorted to adjacent pins. RT (Pin 2): Input Connection for Programming the Switch- ing Frequency. The RT pin servos to a fixed 1.2V when the EN pin is driven to a logic “high”. A resistor from RT to GND sets the charge pump switching frequency. If the RT pin is tied to GND, the switching frequency defaults to a fixed 500kHz. VOUT (Pin 4): Charge Pump Output Voltage. In constant frequency mode (MODE = low) this pin is driven to –VIN. In Burst Mode operation, (MODE = high) this pin voltage is regulated to –0.94 • VIN using an internal burst comparator with hysteretic control. C– (Pin 5): Flying Capacitor Negative Connection. C+ (Pin 8): Flying Capacitor Positive Connection. VIN (Pin 9): Input Voltage for the Charge Pump. VIN should be bypassed with a low impedance ceramic capacitor. EN (Pin 10): Logic Input. A logic “high” on the EN pin enables the inverting charge pump. MODE (Pin 12): Logic Input. The MODE pin deter- mines the charge pump operating mode. A logic “high” on the MODE pin forces the charge pump into Burst Mode operation regulating VOUT to approximately –0.94 • VIN with hysteretic control. A logic “low” on the MODE pin forces the charge pump to operate as an open- loop inverter with a constant switching frequency. The switching frequency in both modes is determined by an external resistor from the RT pin to GND. In Burst Mode, this represents the frequency of the burst cycles before the part enters the low quiescent current sleep state. GND (Exposed Pad Pin 13): Ground. The exposed pack- age pad is ground and must be soldered to the PC board ground plane for proper functionality and for rated thermal performance. |
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