SN65LVPE502

SLLSE29 A

– APRIL 2010 – REVISED FEBRUARY 2012

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PART NUMBER

PART MARKING

PCAKAGE

SN65LVPE502RGER

LVPE502

24-pin RGE Reel (large)

SN65LVPE502RGET

LVPE502

24-pin RGE Reel (small)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

UNITS / VALUES

–0.5 V to 4 V

Differential I/O

–0.5 V to 4 V

Voltage Range

Control I/O

±5000V

Electrostatic discharge

±1500V

±200V

Continuous power dissipation

See Dissipation Rating Table

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-B.

(4)

Tested in accordance with JEDEC Standard 22, Test Method C101-A.

(5)

Tested in accordance with JEDEC Standard 22, Test Method A115-A.

PACKAGE CHARACTERIZATION

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

CM, EN_RXD, EQ cntrl pins = NC, K28.5 pattern at 5 Gbps,

Device power dissipation

330

450

mW

Device power dissipation under low

EN_RXD= GND

0.3

1

mW

power mode

THERMAL INFORMATION

SN65LVPE502

RGE

UNITS

24 PINS

Junction-to-ambient thermal resistance

46

Junction-to-case(top) thermal resistance

42

Junction-to-board thermal resistance

13

°C/W

Junction-to-top characterization parameter

0.5

Junction-to-board characterization parameter

9

Junction-to-case(bottom) thermal resistance

4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6

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