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ADV3205-EVALZ Datasheet(PDF) 6 Page - Analog Devices |
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ADV3205-EVALZ Datasheet(HTML) 6 Page - Analog Devices |
6 / 20 page ADV3205 Data Sheet Rev. 0 | Page 6 of 20 ABSOLUTE MAXIMUM RATINGS POWER DISSIPATION Table 6. Parameter Rating Analog Supply Voltage (AVCC to AVEE) 12 V Digital Supply Voltage (DVCC to DGND) 6 V Ground Potential Difference (AGND to DGND) ±0.5 V Internal Power Dissipation1 3.1 W Analog Input Voltage2 Maintain linear output Digital Input Voltage DVCC Output Voltage (Disabled Output) (AVCC − 1.5 V) to (AVEE + 1.5 V) Output Short-Circuit Duration Momentary Storage Temperature Range −65°C to +125°C Lead Temperature (Soldering 10 sec) 300°C Packaged in a 100-lead LQFP, the ADV3205 junction-to-ambient thermal impedance (θJA) is 40°C/W. For long-term reliability, the maximum allowed junction temperature of the plastic encapsulated die should not exceed 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. The maximum ADV3205 power dissipation occurs when all outputs are enabled and driving loads. Supply current increases approximately linearly with the number of outputs that are enabled. Refer to the Theory of Operation section for more details regarding power dissipation calculations. Figure 4 indicates the maximum ADV3205 power dissipation as a function of ambient temperature. 1 Specification is for device in free air (TA = 25°C): 100-lead plastic LQFP: θJA = 40°C/W. 2 To avoid differential input breakdown, in no case should one-half the output voltage (1/2 VOUT) and any input voltage be greater than 10 V potential differential. See the output voltage swing parameter in Table 1 for the linear output range. TJ = 150°C AMBIENT TEMPERATURE (°C) 4.0 3.5 3.0 2.5 2.0 10 0 2030 40506070 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 4. Maximum Power Dissipation vs. Ambient Temperature ESD CAUTION |
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