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IRF7811 Datasheet(PDF) 5 Page - Analog Devices

Part No. IRF7811
Description  Synchronous Buck Controller
Download  40 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

IRF7811 Datasheet(HTML) 5 Page - Analog Devices

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Data Sheet
ADP1878/ADP1879
Rev. A | Page 5 of 40
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
VREG to PGND, GND
−0.3 V to +6 V
VIN, EN, PGOOD to PGND
−0.3 V to +28 V
FB, COMP, RES, SS to GND
−0.3 V to (VREG + 0.3 V)
DRVL to PGND
−0.3 V to (VREG + 0.3 V)
SW to PGND
−2.0 V to +28 V
BST to SW
−0.6 V to (VREG + 0.3 V)
BST to PGND
−0.3 V to +28 V
DRVH to SW
−0.3 V to VREG
PGND to GND
±0.3 V
PGOOD Input Current
35 mA
θJA (14-Lead LFCSP_WD)
4-Layer Board
30°C/W
Operating Junction Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Soldering Conditions
JEDEC J-STD-020
Maximum Soldering Lead Temperature
(10 sec)
300°C
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to PGND.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Boundary Condition
In determining the values given in Table 2 and Table 3, natural
convection is used to transfer heat to a 4-layer evaluation board.
Table 3. Thermal Resistance
Package Type
θJA
Unit
θJA (14-Lead LFCSP_WD)
4-Layer Board
30
°C/W
ESD CAUTION
Stresses a bove those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.


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