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C3225X5R0J476M Datasheet(PDF) 5 Page - Analog Devices |
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C3225X5R0J476M Datasheet(HTML) 5 Page - Analog Devices |
5 / 20 page Data Sheet ADP2164 Rev. 0 | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating PVIN, VIN, SW −0.3 V to +7 V FB, SYNC, TRK, RT, EN, PGOOD −0.3 V to +7 V PGND to GND −0.3 V to +0.3 V Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is measured using natural convection on a JEDEC 4-layer board. The exposed pad is soldered to the printed circuit board with thermal vias. Table 3. Thermal Resistance Package Type θ JA Unit 16-Lead LFCSP 38.3 °C/W ESD CAUTION |
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