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FDVE1040-1R5M Datasheet(PDF) 6 Page - Analog Devices |
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FDVE1040-1R5M Datasheet(HTML) 6 Page - Analog Devices |
6 / 28 page ADP2381 Data Sheet Rev. 0 | Page 6 of 28 PIN CONFIGURATION AND FUNCTION DESCRIPTION Figure 3. Pin Configuration (Top View) Table 4. Pin Function Descriptions Pin No. Mnemonic Description 1, 2 PVIN Power Input. Connect to the input power source and connect a bypass capacitor between this pin and PGND. 3 UVLO Undervoltage Lockout Pin. An external resistor divider can be used to set the turn-on threshold. 4 PGOOD Power-Good Output (Open Drain). A pull-up resistor of 10 kΩ to 100 kΩ is recommended. 5 RT Frequency Setting. Connect a resistor between RT and GND to program the switching frequency between 250 kHz and 1.4 MHz. If the RT pin is connected to GND, the switching frequency is set to 290 kHz. If the RT pin is open, the switching frequency is set to 550 kHz. 6 SYNC Synchronization Input. Connect this pin to an external clock to synchronize the switching frequency between 250 kHz and 1.4 MHz (see the Oscillator section and the Synchronization section for details). 7 EN/SS Enable Pin (EN). When this pin voltage falls below 0.5 V, the regulator is disabled. Soft Start (SS). This pin can also be used to set the soft start time. Connect a capacitor from SS to GND to program the slow soft start time. If this pin is open, the regulator is enabled and uses the internal soft start. 8 COMP Error Amplifier Output. Connect an RC network from COMP to FB. 9 FB Feedback Voltage Sense Input. Connect to a resistor divider from V OUT. 10 GND Analog Ground. Connect to the ground plane. 11 PGND Power Ground. Connect to the source of the synchronous N-channel MOSFET. 12 VREG Internal 8 V Regulator Output. Place a 1 µF ceramic capacitor between this pin and GND. 13 LD Low-Side Gate Driver Output. Connect this pin to the gate of the synchronous N-MOSFET. 14, 15 SW Switch Node Output. Connect this pin to the output inductor. 16 BST Supply Rail for the High-Side Gate Drive. Place a 0.1 µF ceramic capacitor between SW and BST. 17 EPAD The exposed pad should be soldered to an external ground plane underneath the IC for thermal dissipation. TOP VIEW (Not to Scale) 1 2 3 4 5 6 7 8 ADP2381 16 15 14 13 12 11 10 9 PVIN UVLO PGOOD EN/SS SYNC RT PVIN SW SW LD GND COMP FB PGND VREG BST NOTES 1. THE EXPOSED PAD SHOULD BE SOLDERED TO AN EXTERNAL GROUND PLANE UNDERNEATH THE IC FOR THERMAL DISSIPATION. |
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