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ADM1075-2ACPZ-RL7 Datasheet(PDF) 10 Page - Analog Devices |
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ADM1075-2ACPZ-RL7 Datasheet(HTML) 10 Page - Analog Devices |
10 / 52 page ADM1075 Data Sheet Rev. A | Page 10 of 52 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VIN Pin to VEE −0.3 V to +14 V UVL Pin to VEE −0.3 V to +4 V UVH Pin to VEE −0.3 V to +4 V OV Pin to VEE −0.3 V to +4 V ADC_V Pin to VEE −0.3 V to +4 V ADC_AUX Pin to VEE −0.3 V to +4 V SS Pin to VEE −0.3 V to (VCAP + 0.3 V) TIMER Pin to VEE −0.3 V to (VCAP + 0.3 V) VCAP Pin to VEE −0.3 V to +4 V ISET Pin to VEE −0.3 V to +4 V SPLYGD Pin to VEE −0.3 V to +18 V LATCH Pin to VEE −0.3 V to +18 V RESTART Pin to VEE −0.3 V to +18 V SHDN Pin to VEE −0.3 V to +18 V PWRGD Pin to VEE −0.3 V to +18 V DRAIN Pin to VEE −0.3 V to (VCAP + 0.3 V) SCL Pin to VEE −0.3 V to +6.5 V SDAI Pin to VEE −0.3 V to +6.5 V SDAO Pin to VEE −0.3 V to +6.5 V ADR Pin to VEE −0.3 V to (VCAP + 0.3 V) GPO1/ ALERT1/CONV Pin to VEE −0.3 V to +18 V GPO2/ ALERT2 Pin to VEE −0.3 V to +18 V PLIM Pin to VEE −0.3 V to +4 V GATE Pin to VEE −0.3 V to +18 V SENSE+ Pin to VEE −0.3 V to +4 V SENSE− Pin to VEE −0.3 V to +0.3 V VEE to VEE_G −0.3 V to +0.3 V Continuous Current into Any Pin ±10 mA Storage Temperature Range −65°C to +125°C Operating Junction Temperature Range −40°C to +105°C Lead Temperature, Soldering (10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA1 θJC Unit 28-Lead TSSOP 68 20 °C/W 28-Lead LFCSP 35 4 °C/W 1 Measured on JEDEC 4-layer board in still air. ESD CAUTION |
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