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HYS64V2100G Datasheet(PDF) 9 Page - Siemens Semiconductor Group

Part # HYS64V2100G
Description  3.3V 2M x 64-Bit SDRAM Module 3.3V 2M x 72-Bit SDRAM Module
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Manufacturer  SIEMENS [Siemens Semiconductor Group]
Direct Link  http://www.siemens.com/
Logo SIEMENS - Siemens Semiconductor Group

HYS64V2100G Datasheet(HTML) 9 Page - Siemens Semiconductor Group

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HYS64(72)V2100G(C)U-10
2M x 64/72 SDRAM-Module
Semiconductor Group
9
Notes:
1. The specified values are valid when addresses are changed no more than once during tck(min.)
and when No Operation commands are registered on every rising clock edge during tRC(min).
2. The specified values are valid when data inputs (DQ’s) are stable during tRC(min.).
3. An initial pause of 100
µs is required after power-up, then a Precharge All Banks command must
be given followed by 8 Auto Refresh (CBR) cycles before the Mode Register Set Operation can
begin.
4. AC timing tests have Vil = 0.4 V and Vih = 2.4 V with the timing referenced to the 1.4 V crossover
point. The transition time is measured between V ih and Vil. All AC measurements assume tT=1ns
with the AC output load circuit shown.
5. If clock rising time is longer than 1ns, a time (t T/2 -0.5) ns has to be added to this parameter.
6. If tT is longer than 1 ns, a time (t T-1) ns has to be added to this parameter.
7. Any time that the refresh Period has been exceeded, a minimum of two Auto (CBR) Refresh
commands must be given to “wake-up“the device.
8. Self Refresh Exit is a synchronous operation and begins on the 2nd positive clock edge after
CKE returns high. Self Refresh Exit is not complete until a time period equal to tRC is satisfied
once the Self Refresh Exit command is registered.
9. Referenced to the time which the output achieves the open circuit condition, not to output voltage
levels.
10.tDAL is equivalent to tDPL + tRP.
1.4V
1.4V
tSETUP
tHOLD
tAC
tAC
tLZ
tOH
tHZ
CLOCK
INPUT
OUTPUT
50 pF
I/O
Z=50 Ohm
+ 1.4 V
50 Ohm
2.4 V
0.4 V
tT
fig.1
tCH
tCL


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