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L2520103R3M Datasheet(PDF) 5 Page - Superworld Electronics |
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L2520103R3M Datasheet(HTML) 5 Page - Superworld Electronics |
5 / 7 page NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 13.10.2011 FERRITE CHIP INDUCTORS L201610 SERIES 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern air soldering tools. 8-2.2 Soldering Iron (Figure 2) : 8-2.1 Lead Free Solder Re-flow : wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a) Preheat circuit and products to 150°C. b) 350°C tip temperature (max) c) Never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. Note : 8-2. Soldering 330 e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 4~5 secs. d) 1.0mm tip diameter (max) under mechanical stress as warping the board. the mechanical stress to prevent failure. Products shall be positioned in the sideway direction against PC board should be designed so that products are not sufficient Figure 2. Hand Soldering Gradual Cooling Over 1min. 350 150 Preheating Soldering cooling Natural (max.) 4~5 sec 3.0 1.0 Figure 1. Re-flow Soldering (Pb Free) 480s max. 217 200 260 150 25 Reflow 3 times max. Time (sec) 60~180s 60~150s 20 ~ 40s Preheating Soldering Natural cooling |
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