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MIC2165YMME Datasheet(PDF) 22 Page - Micrel Semiconductor

Part # MIC2165YMME
Description  Adaptive On-Time DC-DC Controller Featuring HyperLight Load짰
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC2165YMME Datasheet(HTML) 22 Page - Micrel Semiconductor

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Micrel, Inc.
MIC2165
September 2010
22
M9999-092410-E
PCB Layout Guidelines
Warning!!! To minimize EMI and output noise, follow
these layout recommendations.
PCB Layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to control
EMI and minimize the inductance in power, signal and
return paths.
The following guidelines should be followed to insure
proper operation of the MIC2165 converter.
IC
Place the IC and MOSFETs close to the point of load
(POL).
Use fat traces to route the input and output power
lines.
Signal and power grounds should be kept separate
and connected at only one location.
The exposed pad (ePad) on the bottom of the IC must
be connected to the ground through several vias.
The feedback resistors should be placed close to the
FB pin. The top feedback resistor should connect
directly to the output node. Run this trace away from
the switch node (SW).
Input Capacitor
Place the VIN input capacitor next.
Place the VIN input capacitors on the same side of the
board and as close to the MOSFETs as possible.
Keep both the VIN and PGND connections short.
Place several vias to the ground plane close to the VIN
input capacitor ground terminal.
Use either X7R or X5R dielectric input capacitors. Do
not use Y5V or Z5U type capacitors.
Do not replace the ceramic input capacitor with any
other type of capacitor. Any type of capacitor can be
placed in parallel with the input capacitor.
If a Tantalum input capacitor is placed in parallel with
the input capacitor, it must be recommended for
switching regulator applications and the operating
voltage must be derated by 50%.
In “Hot-Plug” applications, a Tantalum or Electrolytic
bypass capacitor must be used to limit the over-
voltage spike seen on the input supply with power is
suddenly applied.
The 2.2µF (minumum) capacitors, which connect to
the VDD terminal, must be located right at the IC. The
VDD terminal is very noise sensitive and placement of
the capacitor is very critical. Connections must be
made with wide trace.
Inductor
Keep the inductor connection to the switch node (SW)
short.
Do not route any digital lines underneath or close to
the inductor.
Keep the switch node (SW) away from the feedback
(FB) pin.
The SW pin should be connected directly to the drain
of the low-side MOSFET to accurate sense the voltage
across the low-side MOSFET.
To minimize noise, place a ground plane underneath
the inductor.
Output Capacitor
Use a wide trace to connect the output capacitor
ground terminal to the input capacitor ground terminal.
Phase margin will change as the output capacitor
value and ESR changes. Contact the factory if the
output capacitor is different from what is shown in the
BOM.
The feedback trace should be separate from the power
trace and connected as close as possible to the output
capacitor. Sensing a long high current load trace can
degrade the DC load regulation.
Schottky Diode
Place the Schottky diode on the same side of the
board as the MOSFETs and VIN input capacitor.
The connection from the Schottky diode’s Anode to the
input capacitors ground terminal must be as short as
possible.
The diode’s Cathode connection to the switch node
(SW) must be keep as short as possible.
RC Snubber
Place the RC snubber on the same side of the board
and as close to the MOSFETs as possible.
MOSFETs
Low-side MOSFET gate drive trace (DL pin to
MOSFET gate pin) must be short and routed over a
ground plane. The ground plane should be the
connection between the MOSFET source and PGND.
Chose a low-side MOSFET with a high CGS/CGD ratio
and a low internal gate resistance to minimize the
effect of dv/dt inducted turn-on.
Do not put a resistor between the LSD output and the
gate.
Use a 4.5V VGS rated MOSFET. Its higher gate
threshold voltage is more immune to glitches than a
2.5V or 3.3V rated MOSFET. MOSFETs that are rated
for operation at less than 4.5V VGS should not be used.


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