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MIC5252-2.8YML Datasheet(PDF) 3 Page - Micrel Semiconductor

Part # MIC5252-2.8YML
Description  150mA High PSRR, Low Noise 關Cap CMOS LDO
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC5252-2.8YML Datasheet(HTML) 3 Page - Micrel Semiconductor

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MIC5252
Micrel, Inc.
February 2005
3
M9999-020305
Electrical Characteristics(5)
VIN = VOUT + 1V, VEN = VIN; IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted.
Symbol
Parameter
Conditions
Min
Typical Max
Units
VO
Output Voltage Accuracy
IOUT = 100µA
–1
1
%
–3
3
%
ΔVLNR
Line Regulation
VIN = VOUT + 1V to 6V
0.02
0.2
%
ΔVLDR
Load Regulation
IOUT = 0.1mA to 150mA(6)
0.6
1.5
%
VIN – VOUT
Dropout Voltage(7)
IOUT = 100µA
0.1
5
mV
IOUT = 100mA
90
150
mV
IOUT = 150mA
135
200
mV
250
mV
IQ
Quiescent Current
VEN ≤ 0.4V (shutdown)
0.2
1
µA
IGND
Ground Pin Current(8)
IOUT = 0mA
90
150
µA
IOUT = 150mA
117
200
µA
PSRR
Ripple Rejection; IOUT = 150mA
f = 10Hz, COUT = 1.0µF, CBYP = 0.01µF
63
dB
f = 10Hz, VIN = VOUT + 0.3V
48
dB
f = 10kHz, VIN = VOUT + 0.3V
48
dB
ILIM
Current Limit
VOUT = 0V
250
425
mA
en
Output Voltage Noise
COUT = 1.0µF, CBYP = 0.01µF,
30
µV(rms)
f = 10Hz to 100kHz
Enable Input
VIL
Enable Input Logic-Low Voltage
VIN = 2.7V to 5.5V, regulator shutdown
0.4
V
VIH
Enable Input Logic-High Voltage
VIN = 2.7V to 5.5V, regulator enabled
1.6
V
IEN
Enable Input Current
VIL ≤ 0.4V, regulator shutdown
0.01
1
µA
VIH ≥ 1.6V, regulator enabled
0.01
1
µA
Shutdown Resistance Discharge
500
Ω
Thermal Protection
Thermal Shutdown Temperature
150
°C
Thermal Shutdown Hysteresis
10
°C
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max)–TA)/θJA. Exceeding the maximum allowable
power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The θJA of the MIC5252-x.xBM5 (all ver-
sions) is 235°C/W on a PC board. See ”Thermal Considerations” section for further details.
4. Devices are ESD sensitive. Handling precautions recommended.
5. Specification for packaged product only.
6. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range
from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
7. Dropout Voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at 1V differen-
tial. For outputs below 2.7V, dropout voltage is the input-to-output voltage differential with the minimum input voltage 2.7V. Minimum input operating
voltage is 2.7V.
8. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin cur-
rent.
Absolute Maximum Ratings(1)
Supply Input Voltage (VIN)....................................0V to +7V
Enable Input Voltage (VEN) ..................................0V to +7V
Power Dissipation (PD)..........................Internally Limited(3)
Junction Temperature (TJ)........................ –40°C to +125°C
Storage Temperature................................ –65°C to +150°C
Lead Temperature (soldering, 5 sec.)........................ 260°C
ESD(4)............................................................................ 2kV
Operating Ratings(2)
Input Voltage (VIN).......................................... +2.7V to +6V
Enable Input Voltage (VEN) ...................................0V to VIN
Junction Temperature (TJ)........................ –40°C to +125°C
Thermal Resistance
SOT-23 (θJA)......................................................235°C/W
2x2 MLF™ (θJA) ..................................................90°C/W


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