MIC5209-3.0BS datasheet(11/13 Pages) MICREL

Part #	MIC5209-3.0BS

Description	500mA Low-Noise LDO Regulator

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Manufacturer	MICREL [Micrel Semiconductor]

Direct Link	http://www.micrel.com

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11 / 13 page

June 2006

11

M9999-060906

MIC5209

Micrel, Inc.

Considering worst case tolerances, the power dissipation

could be as high as:

(VIN(max) – VOUT(max)) × IOUT + VIN(max) × IGND

[(3.6V – 2.375V) × 320mA] + (3.6V × 4mA)

PD = 407mW

Using the maximum junction temperature of 125°C and a θJC

of 8°C/W for the SOT-223, 25°C/W for the SO-8, or 2°C/W

for the TO-263 package, the following worst-case heat-sink

thermal resistance (θSA) requirements are:

θJA

J(max)

A

D

TJ(max

J(max

TAA

PDD

=

−

θSA = θ

SA

JA = θ

JA

JC

TA

TT

40°C

50°C

60°C

75°C

A

θJA (limit)

209°C/W

184°C/W 160°C/W 123°C/W

θSA SOT-223 201°C/W 176°C/W 152°C/W 115°C/W

SA

θSA SO-8

184°C/W

159°C/W 135°C/W

98°C/W

SA

θSA TO-263-5 207°C/W 182°C/W 158°C/W 121°C/W

SA

Table 2. Maximum Allowable Thermal Resistance

Table 2 and Figure 6 show that the Slot-1 power supply ap-

plication can be implemented with a minimum footprint layout.

T

40°C

50°C

60°C

75°C

(limit)

209°C/W

184°C/W 160°C/W 123°C/W

SOT-223

201°C/W

176°C/W 152°C/W 115°C/W

SO-8

184°C/W

159°C/W 135°C/W

98°C/W

TO-263-5 207°C/W

182°C/W 158°C/W 121°C/W

Figure 6 shows the necessary copper pad area to obtain

speciﬁc heat sink thermal resistance (θSA) values. The θSA

values in Table 2 require much less than 500mm2 of copper,

according to Figure 6, and can easily be accomplished with

the minimum footprint.

0

10

20

30

40

50

60

70

0

2000

4000

6000

COPPER HEAT SINK AREA (mm2

COPPER HEAT SINK AREA (mm

COPPER HEAT SINK AREA (mm )

Figure 6. PCB Heat Sink Thermal Resistance

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