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TPS84610RKGT Datasheet(PDF) 2 Page - Texas Instruments |
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TPS84610RKGT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) MINIMUM ORDERABLE TA PACKAGE PINS TRANSPORT MEDIA ECO PLAN QUANTITY NUMBER Green (RoHS and no Large tape and reel 500 TPS84610RKGR Plastic Quad Sb/Br) -40 °C to 85°C Flat Pack 39 Green (RoHS and no (BQFN) Small tape and reel 250 TPS84610RKGT Sb/Br) (1) For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating temperature range (unless otherwise noted) VALUE UNIT MIN MAX VIN, PWRGD –0.3 7 V INH/UVLO, RT/CLK –0.3 3.3 V Input Voltage SS/TR, STSEL, VADJ –0.3 3 V SENSE+ VADJ rating must also be met -0.3 VOUT V PH –0.6 7 V Output Voltage PH 10 ns, transient –2 7 V VOUT -0.6 VIN V VDIFF (GND to exposed thermal pad) –0.2 0.2 V RT/CLK, INH/UVLO ±100 µA Source Current PH Current Limit A PH Current Limit A Sink Current SS/TR ±100 µA PWRGD 10 mA Operating Junction Temperature –40 125(2) °C Storage Temperature, Tstg –65 150 °C Mechanical Shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 1500 G Mechanical Vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20 (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) See the temperature derating curves in the Typical Characteristics section for thermal information. 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 |
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