3

SY58020U

Micrel, Inc.

M9999-102811

hbwhelp@micrel.com or (408) 955-1690

Input Current

Source or sink current on IN, /IN ......................... ±50mA

Package Thermal Resistance

QFN

Still-Air ............................................................ 60°C/W

500lfpm ........................................................... 54°C/W

QFN

(Junction-to-Board Resistance), Note 3 ......... 33°C/W

Lead Temperature Soldering, (20 seconds) ............. 260°C

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Voltage

2.375

2.5

2.625

V

3.0

3.3

3.60

V

Power Supply Current

150

180

mA

(includes internal 50ohms pull-up)

Input HIGH Voltage

Note 6

V

Input LOW Voltage

0

V

Input Voltage Swing

See Figure 1a

0.1

1.7

V

Differential Input Voltage Swing

See Figure 1b

0.2

3.4

V

40

50

60

ohms

Output Reference Voltage

V

1.28

V

Symbol

Parameter

Condition

Min

Typ

Max

Units

Output HIGH Voltage

V

Output Voltage Swing

see Figure 1a

325

400

500

mV

Differential Output Voltage Swing

see Figure 1b

650

800

1000

mV

Output Source Impedance

40

50

60

ohms

Note 1.

Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional

operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE

MAXIMUM RATINGS conditions for extended periods may affect device reliability.

Note 2.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

Note 3.

Thermal performance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.

Note 4.

Due to the limited drive capability, use for input of the same package only.

Note 5.

The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

Note 6.