10

SY58020U

Micrel, Inc.

M9999-102811

hbwhelp@micrel.com or (408) 955-1690

16 LEAD QFN (QFN-16)

Package

EP- Exposed Pad

Die

CompSide Island

Heat Dissipation

Heavy Copper Plane

Heavy Copper Plane

Heat Dissipation

PCB Thermal Consideration for 16-Pin QFN Package

(Always solder, or equivalent, the exposed pad to the PCB)

Package Notes:

Note 1.

Package meets Level 2 qualification.

Note 2.

All parts are dry-packaged before shipment.

Note 3.

Exposed pads must be soldered to a ground for proper thermal management.

MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

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