Micrel, Inc.

SY88345BL

February 2007

4

M9999-021207-B

hbwhelp@micrel.com or (408) 955-1690

Absolute Maximum Ratings

(1)

Lead Temperature (soldering, 20sec.) .................. 260°C

Operating Ratings

(2)

Junction Thermal Resistance

QFN

(

θ

(

Ψ

EPAD-MSOP

(

θ

(

Ψ

DC Electrical Characteristics

Ω to V

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Current

No output load

42

65

mA

V

CML Output HIGH Voltage

V

CML Output LOW Voltage

V

Differential Output Offset

+80

mV

Single-Ended Output Impedance

40

50

60

Ω

Single-Ended Input Impedance

40

50

60

Ω

Reference Voltage

V

TTL DC Electrical Characteristics

Ω to V

Symbol

Parameter

Condition

Min

Typ

Max

Units

EN Input HIGH Voltage

2.0

V

EN Input LOW Voltage

0.8

V

EN Input HIGH Current

20

100

µA

µA

EN Input LOW Current

-300

µA

SD Output HIGH Level

2.4

V

2.0

V

SD Output LOW Level

Sinking 2mA

0.5

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not

implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB.

Ψ

JB

uses 4-layer (

θ