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AM50-0001 Datasheet(PDF) 3 Page - M/A-COM Technology Solutions, Inc. |
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AM50-0001 Datasheet(HTML) 3 Page - M/A-COM Technology Solutions, Inc. |
3 / 7 page GaAs MMIC Low Noise Amplifier SOIC-8 Platform Rev. V3 Application Note M540 • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 3 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. The AM50-0002 employs a combination of the LG and HG designs to create a three stage, higher gain, LNA. The AM50-0002, however, uses a simple external input matching network to obtain minimum noise figure. A detailed discussion of this external matching network is contained in the section on customer use considerations. In this product platform there are essentially two circuit design types, a low gain (LG) and a high gain (HG). The LG design (MAAM12022, MAAM12032, MAAM22010, and AM50-0001), shown in Figure 3, employs a single stage cascade configuration with series feedback to si- multaneously achieve impedance match and minimum noise figure. The HG design (MAAM12021 and MAAM12031), shown in Figure 4, uses two cascaded common source stages biased in series to achieve the high gain at low current consumption, and also employs series feedback to simultaneously achieve impedance match and minimum noise figure. The AM50-0002 em- ploys a combination of the LG and HG designs to create a three stage, higher gain, LNA. The AM50-0002, how- ever, uses a simple external input matching network to obtain minimum noise figure. A detailed discussion of this external matching network is contained in the section on customer use considerations. The MMIC layout of Figure 5 is the MAAM12021, the largest chip of the family; it measures 1 mm on a side. Figure 6 illustrates the assembly of this MMIC into the SOIC-8 package. Immediately one notices that the lead frame is split and there is more than one chip in the plas- tic package. The amplifier employs a custom fused split paddle lead frame to ensure unconditional stability when used on a typical FR4 board application. The other chip in the package is a metal-nitride-silicon (MNS) single- layer capacitor used for internal RF by-passing to allow biasing from a single positive 3-5 V supply. These MNS capacitors, supplied by M/A-COM’s Semiconductor Busi- ness Unit, have almost ideal performance for very little cost. After assembly, the MAAM12021 has the func- tional diagram as shown in Figure 7. Six of the seven LNAs in this product platform share these assembly and functional diagrams. The AM50-0002 utilizes a slightly different lead frame and pin assignment to accommodate the special requirements of its three stage, high gain design. MMIC Manufacturing Considerations The MMIC LNAs are automatically assembled onto cus- tom designed, fused, split paddle lead frames as shown previously in Figure 6. Careful consideration is given to die placement, both for the GaAs MMIC LNA and the MNS capacitor, to ensure repeatable bond wire induc- tance and good mechanical strength for reliability. The ground leads are fused to ensure low inductance grounds as well as low thermal impedance. These fused ground leads also lower cost in volume production by eliminating eight ground bonds (2 per lead). Once as- sembled onto the lead frames, the assembly is transfer molded with a plastic which has both good moisture re- sistance properties for reliability and well controlled di- electric constant for repeatable RF performance. Fully assembled MMIC LNAs are stored in antistatic tubes, ready for automatic test. Fully assembled MMIC LNAs are 100% RF tested for compliance against the guaranteed data sheet perform- ance of gain, nose figure, and DC current. Standard automatic digital IC testers have been modified to make rapid RF measurements. Accuracy is maintained by establishing correlation coefficients between the high speed automated production testers and the highly accu- rate engineering measurement system. Quality and Reliability The MMIC LNA products are subjected to a one-time product qualification, either before product releases or when there is a major process change. In the case of the MMIC LNAs, the one-time qualification, according to Table 1, has established the MMIC LNA product family to be capable of serving the high volume global commercial electronics market with a 400-FIT reliability rate (300 devices at an activation energy of 0.7 eV, normal operat- ing temperature of 85˚C, and 90% confidence level). The MMIC LNAs are also ESD classified as low level class 1—as low as 350 volts can induce damage. Table 2 shows the on-going quality monitoring of plastic pack- aged devices in production to maintain the established level of product quality. This 400-FIT reliability level is established at a junction temperature of 150˚C or less. This is the reason for the maximum rating on the data sheet of 150˚C or less. The junction temperature can be calculated from the product of the thermal resistance and power dissipated. The thermal resistance for the MMIC LNAs is 165˚C/W on all LNA’s, except for the AM50-0001 where it is 125˚C/W. |
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