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P1AFS600 Datasheet(PDF) 3 Page - Microsemi Corporation

Part No. P1AFS600
Description  Fusion Family of Mixed Signal FPGAs
Download  334 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

P1AFS600 Datasheet(HTML) 3 Page - Microsemi Corporation

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Fusion Family of Mixed Signal FPGAs
R e visi on 2
III
Product Ordering Codes
Fusion Device Status
Notes:
1. For Fusion devices, Quad Flat No Lead packages are only offered as RoHS compliant, QNG packages.
2. MicroBlade and Pigeon Point devices only support FG packages.
Fusion
Status
Cortex-M1
Status
Pigeon Point
Status
MicroBlade
Status
AFS090
Production
AFS250
Production
M1AFS250
Production
AFS600
Production
M1AFS600
Production
P1AFS600
Production
U1AFS600
Production
AFS1500
Production
M1AFS1500
Production
P1AFS1500
Production
M1AFS600
FG
_
Part Number
Fusion Devices
Speed Grade
1
Blank = Standard
1 = 15% Faster than Standard
2 = 25% Faster than Standard
Package Type
QN = Quad Flat No Lead (0.5 mm pitch)
256
I
G
Package Lead Count
Y
Security Feature
Application (junction temperature range)
Blank = Commercial (0 to +85°C)
I = Industrial (–40 to +100°C)
PP = Pre-Production
ES = Engineering Silicon (room temperature only)
90,000 System Gates
AFS090 =
250,000 System Gates
AFS250 =
ARM-Enabled Fusion Devices
600,000 System Gates
AFS600 =
1,500,000 System Gates
AFS1500 =
MicroBlade Devices
600,000 System Gates
U1AFS600 =
Pigeon Point Devices
600,000 System Gates
P1AFS600 =
1,500,000 System Gates
P1AFS1500 =
250,000 System Gates
M1AFS250 =
600,000 System Gates
M1AFS600 =
1,500,000 System Gates
M1AFS1500 =
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
Lead-Free Packaging Options
Blank = Standard Packaging
G = RoHS-Compliant (green) Packaging
1
2
Y = Device Includes License to Implement IP Based on the
Cryptography Research, Inc. (CRI) Patent Portfolio


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