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UCC27423-Q1 Datasheet(PDF) 3 Page - Texas Instruments

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Part No. UCC27423-Q1
Description  DUAL 4-A HIGH-SPEED LOW-SIDE MOSFET DRIVERS WITH ENABLE
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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UCC27423-Q1 Datasheet(HTML) 3 Page - Texas Instruments

 
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UCC27423-Q1
UCC27424-Q1
UCC27425-Q1
www.ti.com
SGLS274D
– SEPTEMBER 2008 – REVISED AUGUST 2011
INPUT/OUTPUT TABLE
INPUTS (VIN_L, VIN_H)
UCC27423
UCC27424
UCC27425
ENBA
ENBB
INA
INB
OUTA
OUTB
OUTA
OUTB
OUTA
OUTB
H
H
L
L
H
H
L
L
H
L
H
H
L
H
H
L
L
H
H
H
H
H
H
L
L
H
H
L
L
L
H
H
H
H
L
L
H
H
L
H
L
L
X
X
L
L
L
L
L
L
ABSOLUTE MAXIMUM RATINGS
(1) (2)
over operating free-air temperature range (unless otherwise noted)
VDD
Supply voltage
–0.3 V to 16 V
DC
0.3 A
IOUT
Output current
Pulsed, 0.5
μs
4.5 A
–5 V to 6 V or (VDD + 0.3)
VIN
Input voltage
INA, INB
(whichever is larger)
–0.3 V to 6 V or (VDD + 0.3)
VEN
Enable voltage
ENBA, ENBB
(whichever is larger)
PD
Power dissipation
TA = 25°C
650 mW
TJ
Junction operating temperature range
–55°C to 150°C
Tstg
Storage temperature range
–65°C to 150°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to GND. Currents are positive into, negative out of, the specified terminal.
DISSIPATION RATINGS
DERATING FACTOR
POWER RATING
PACKAGE
θJC (°C/W)
θJA (°C/W)
ABOVE TA = 70°C
TA = 70°C (mW)
(1)
(mW/
°C)(1)
D (SOIC-8)
42
84 to 160(2)
344 to 655(2)
6.25 to 11.9(2)
DGN (MSOP
4.7
50 to 59
1370
17.1
PowerPAD)(3)
(1)
125
°C operating junction temperature is used for power rating calculations.
(2)
The range of values indicates the effect of the PCB. These values are intended to give the system designer an indication of the best-
and worst-case conditions. In general, the system designer should attempt to use larger traces on the PCB, where possible, to spread
the heat away form the device more effectively.
(3)
The PowerPAD
™ is not directly connected to any leads of the package. However, it is electronically and thermally connected to the
substrate which is the ground of the device.
Copyright
© 2008–2011, Texas Instruments Incorporated
3


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