Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF HTML

UCC27423-Q1 Datasheet(PDF) 16 Page - Texas Instruments

Click here to check the latest version.
Part No. UCC27423-Q1
Description  DUAL 4-A HIGH-SPEED LOW-SIDE MOSFET DRIVERS WITH ENABLE
Download  28 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
Logo 

UCC27423-Q1 Datasheet(HTML) 16 Page - Texas Instruments

Zoom Inzoom in Zoom Outzoom out
 16 / 28 page
background image
UCC27423
GND
1
2
3
4
INB
INA
7
6
5
8
OUTA
VDD
OUTB
INPUT
CER
VDD
ENBB
ENBA
CLOAD
2.2
µF
1
µF
UCC27423-Q1
UCC27424-Q1
UCC27425-Q1
SGLS274D
– SEPTEMBER 2008 – REVISED AUGUST 2011
www.ti.com
Parallel Outputs
The A and B drivers may be combined into a single driver by connecting the INA/INB inputs together and the
OUTA/OUTB outputs together. Then, a single signal can control the paralleled combination as shown in
Figure 31.
Figure 31. Parallel Outputs
Operational Waveforms and Circuit Layout
Figure 32 shows the circuit performance achievable with a single driver (half of the 8-pin IC) driving a 10-nF load.
The input pulse width (not shown) is set to 300 ns to show both transitions in the output waveform. Note the
linear rise and fall edges of the switching waveforms. This is due to the constant output current characteristic of
the driver as opposed to the resistive output impedance of traditional MOSFET-based gate drivers.
Figure 32. Pulse Response
In a power driver operating at high frequency, it is a significant challenge to get clean waveforms without much
overshoot/undershoot and ringing. The low output impedance of these drivers produces waveforms with high
di/dt. This tends to induce ringing in the parasitic inductances. Utmost care must be used in the circuit layout. It is
advantageous to connect the driver IC as close as possible to the leads. The driver IC layout has ground on the
opposite side of the output, so the ground should be connected to the bypass capacitors and the load with
copper trace as wide as possible. These connections should also be made with a small enclosed loop area to
minimize the inductance.
16
Copyright
© 2008–2011, Texas Instruments Incorporated


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28 


Datasheet Download




Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ]  

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Alldatasheet API   |   Link Exchange   |   Manufacturer List
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn