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BSM400GB60DN2 Datasheet(PDF) 1 Page - Siemens Semiconductor Group

Part No. BSM400GB60DN2
Description  IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
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Maker  SIEMENS [Siemens Semiconductor Group]
Homepage  http://www.siemens.com/
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BSM400GB60DN2 Datasheet(HTML) 1 Page - Siemens Semiconductor Group

   
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Semiconductor Group
1
Apr-25-1997
BSM 400 GB 60 DN2
IGBT Power Module
Preliminary data
• Half-bridge
• Including fast free-wheeling diodes
• Package with insulated metal base plate
Type
VCE
IC
Package
Ordering Code
BSM 400 GB 60 DN2
600V
475A
HALF-BRIDGE 2
C67070-A2120-A67
Maximum Ratings
Parameter
Symbol
Values
Unit
Collector-emitter voltage
VCE
600
V
Collector-gate voltage
RGE = 20 kΩ
VCGR
600
Gate-emitter voltage
VGE
± 20
DC collector current
TC = 25 °C
TC = 60 °C
IC
400
475
A
Pulsed collector current,
tp = 1 ms
TC = 25 °C
TC = 60 °C
ICpuls
800
950
Power dissipation per IGBT
TC = 25 °C
Ptot
1400
W
Chip temperature
Tj
+ 150
°C
Storage temperature
Tstg
-40 ... + 125
Thermal resistance, chip case
RthJC
≤ 0.09
K/W
Diode thermal resistance, chip case
RthJCD
≤ 0.18
Insulation test voltage,
t = 1min.
Vis
2500
Vac
Creepage distance
-
20
mm
Clearance
-
11
DIN humidity category, DIN 40 040
-
F
sec
IEC climatic category, DIN IEC 68-1
-
40 / 125 / 56


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