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SP3002 Datasheet(PDF) 3 Page - Littelfuse

Part No. SP3002
Description  SP3002 Series 0.85pF Rail Clamp Array
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Manufacturer  LITTELFUSE [Littelfuse]
Direct Link  http://www.littelfuse.com
Logo LITTELFUSE - Littelfuse

SP3002 Datasheet(HTML) 3 Page - Littelfuse

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©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to
www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPAFamily of Products)
Revision: April 14, 2011
SP3002 Series
Low Capacitance ESD Protection - SP3002 Series
Capacitance vs. Frequency
0
2E-13
4E-13
6E-13
8E-13
1E-12
1.2E-12
1.4E-12
1.6E-12
1.8E-12
2E-12
1.E+06
1.E+07
1.E+08
1.E+09
Frequency [Hz]
Time
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
Preheat
Ramp-up
Ramp-up
Ramp-down
Ramp-do
Critical Zone
TL to TP
Critical Zone
TL to TP
Reflow Condition
Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min))
150°C
- Temperature Max (T
s(max))
200°C
- Time (min to max) (t
s)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L) to peak
3°C/second max
T
S(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (T
L) (Liquidus)
217°C
- Temperature (t
L)
60 – 150 seconds
Peak Temperature (T
P)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (t
p)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (T
P)
8 minutes Max.
Do not exceed
260°C
Soldering Parameters
Product Characteristics
Lead Plating
SC70 & SOT23: Matte Tin
uDFN: Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.


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