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EPC111 Datasheet(PDF) 11 Page - Espros Photonics corp

Part No. EPC111
Description  Fully integrated standalone light barrier driver & receiver
Download  14 Pages
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Maker  EPC [Espros Photonics corp]
Homepage  http://www.espros.ch
Logo EPC - Espros Photonics corp

EPC111 Datasheet(HTML) 11 Page - Espros Photonics corp

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epc111/112
Layout Information (all measures in mm,
<Partname>
<x000 000>
<Name>
<Data>
M 1:1
DIN A4
<Name>
Part Name
Part No.
Designed
Approved
Scale
Page
File: Unben annt
1
26.02.2009
)
CSP-10 Package
1.9 +0.0/-0.1
0.5
0.5
0.15
Solder balls Sn97.5Ag2.5
∅ 0.12
Bottom View
Pin 1
19.01.2012
Page 1
File:
This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission
.
no solder mask inside this area
0.5
0.5
∅ 0.3
2.5
0.1524
Figure 13: CSP10: Mechanical dimensions
Figure 14: CSP10: Layout recommendation
Recommendations for reliable soldering of solder balls:
Use a pad layout similar to the one shown in Figure 14. Notice that all tracks should go underneath the solder mask area.
Do not connect any pins direct pin to pin inside of the opening of the solder mask.
In case of the conductors are with a Au-Ni surface finish the preferred landing pad design for the solder balls will be covering the
round landing pad with a gold surface finish as a solderable area only.
QFN-16 Package
PIN Connections QFN16-VEED-
1VN4
LST
11.01.2011
Page 1
File:
This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission
.
PIN Connections QFN16-VEED-
1VN4
LST
Top View
1
2
3
4
PD
GND
LED
NC
NC_GND
NC_GND
NC_GND
NC_GND
Opening in solder mask
Conductor layout
Shielding of PD pin
Figure 15: QFN-16: Layout recommendation
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
11
Datasheet epc111_112 - V2.2
www.espros.ch


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