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PMEG2005EPK Datasheet(PDF) 9 Page - NXP Semiconductors |
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PMEG2005EPK Datasheet(HTML) 9 Page - NXP Semiconductors |
9 / 13 page PMEG2005EPK All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 12 January 2012 9 of 13 NXP Semiconductors PMEG2005EPK 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 9. Package outline 10. Soldering Fig 15. Package outline SOD1608 Dimensions in mm 1.65 1.55 0.04 0.85 0.75 0.75 0.67 0.40 0.34 0.80 0.72 0.40 0.32 11-11-21 1 2 Reflow soldering is the only recommended soldering method. Fig 16. Reflow soldering footprint for SOD1608 0.9 0.7 0.8 1.15 1.05 0.95 1.9 1.8 0.1 0.2 12 2.0 0.75 0.65 0.55 0.9 0.7 0.8 occupied area solder land solder resist solder land plus solder paste solder paste deposit Dimensions in mm Footprint information for reflow soldering of SOD1608 package SOD1608 sod1608_fr |
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