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W25X32A Datasheet(PDF) 38 Page - Winbond |
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W25X32A Datasheet(HTML) 38 Page - Winbond |
38 / 45 page W25X32A - 38 - 12 PACKAGE SPECIFICATION 12.1 8-Pin SOIC 208-mil (Package Code SS) MILLIMETERS INCHES SYMBOL MIN NOM MAX MIN NOM MAX A 1.75 1.95 2.16 0.069 0.077 0.085 A1 0.05 0.15 0.25 0.002 0.006 0.010 A2 1.70 1.80 1.91 0.067 0.071 0.075 b 0.35 0.42 0.48 0.014 0.017 0.019 C 0.19 0.20 0.25 0.007 0.008 0.010 D 5.18 5.28 5.38 0.204 0.208 0.212 D1 5.13 5.23 5.33 0.202 0.206 0.210 E 5.18 5.28 5.38 0.204 0.208 0.212 E1 5.13 5.23 5.33 0.202 0.206 0.210 e 1.27 BSC 0.050 BSC H 7.70 7.90 8.10 0.303 0.311 0.319 L 0.50 0.65 0.80 0.020 0.026 0.031 y - - 0.010 - - 0.004 θ 0° - 8° 0° - 8° Notes: 1. Controlling dimensions: millimeters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches. |
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Similar Description - W25X32A |
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