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W25Q64BVSSIG Datasheet(PDF) 58 Page - Winbond |
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W25Q64BVSSIG Datasheet(HTML) 58 Page - Winbond |
58 / 61 page W25Q64BV - 58 - 13.4 16-Pin SOIC 300-mil (Package Code SF) GAUGE PLANE DETAIL A GAUGE PLANE DETAIL A MILLIMETERS INCHES SYMBOL Min Nom Max Min Nom Max A 2.36 2.49 2.64 0.093 0.098 0.104 A1 0.10 --- 0.30 0.004 --- 0.012 A2 --- 2.31 --- --- 0.091 --- b 0.33 0.41 0.51 0.013 0.016 0.020 C 0.18 0.23 0.28 0.007 0.009 0.011 D 10.08 10.31 10.49 0.397 0.406 0.413 E 10.01 10.31 10.64 0.394 0.406 0.419 E1 7.39 7.49 7.59 0.291 0.295 0.299 e (2) 1.27 BSC. 0.050 BSC. L 0.38 0.81 1.27 0.015 0.032 0.050 y --- --- 0.076 --- --- 0.003 θ 0° --- 8° 0° --- 8° Notes: 1. Controlling dimensions: inches, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. |
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