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TR8M106K6R3C2000 Datasheet(PDF) 4 Page - Vishay Siliconix

Part # TR8M106K6R3C2000
Description  Solid Tantalum Chip Capacitors MICROTANTM Low ESR, Leadframeless Molded
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

TR8M106K6R3C2000 Datasheet(HTML) 4 Page - Vishay Siliconix

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TR8
www.vishay.com
Vishay Sprague
Revision: 09-Aug-11
4
Document Number: 40114
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Life Test at + 85 °C
1000 h application of rated voltage at
85 °C with a 3
 series resistance,
MIL-STD 202G method 108A
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Humidity Tests
At 40 °C/90 % RH 500 h, no voltage applied
MIL-STD 202G method 103B
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Thermal Shock
At - 55 °C/+ 125 °C, 30 min each, for 5 cycles.
MIL-STD 202G method 107G
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
MECHANICAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Terminal Strength
Apply a pressure load of 5 N for 10 s ± 1 s
horizontally to the center of capacitor side body.
AEC-Q200 rev. C method 006
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Substrate Bending
(Board Flex)
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AEC-Q200 rev. C method 005
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
Vibration
MIL-STD-202G, method 204D,
10 Hz to 2000 Hz, 20 g Peak
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Shock
MIL-STD-202G, method 213B, condition I,
100 g peak
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to
Solder Heat
At 260 °C, for 10 s, reflow
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Solderability
MIL-STD-202G, method 208H, ANSI/J-STD-002,
Test B. Applies only to solder and tin plated
terminations. Does not apply to gold terminations.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to
Solvents
MIL-STD-202, method 215D
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Flammability
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %.


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