Output Current (A)

0

2

4

6

8

10

12

14

16

18

20

0

0.5

1

1.5

2

2.5

3

3.5

4

G001

Junction Temperature ( °C)

-50

-25

0

25

50

75

100

125

150

0.5

0.6

0.7

0.8

0.9

1

1.1

1.2

G002

Ambient Temperature ( °C)

0

10

20

30

40

50

60

70

80

90

0

5

10

15

20

25

G003

400LFM

200LFM

100LFM

Nat Conv

Ambient Temperature ( °C)

0

10

20

30

40

50

60

70

80

90

0

5

10

15

20

25

G004

400LFM

200LFM

100LFM

Nat Conv

Board Temperature (°C)

0

20

40

60

80

100

120

140

0

5

10

15

20

25

G005

CSD86330Q3D

SLPS264C

– OCTOBER 2010 – REVISED OCTOBER 2011

www.ti.com

TYPICAL POWER BLOCK DEVICE CHARACTERISTICS

otherwise.

Figure 1. Power Loss vs Output Current

Figure 2. Power Loss vs Temperature

Figure 3. Safe Operating Area

Figure 4. Safe Operating Area

(1)

The Typical Power Block System Characteristic curves are based on measurements made on a PCB design with

dimensions of 4.0

” (W) × 3.5” (L) × 0.062” (H) and 6 copper layers of 1 oz. copper thickness. See Application Section

for detailed explanation.

4

Submit Documentation Feedback

Copyright

© 2010–2011, Texas Instruments Incorporated