ISL97649BIRZ datasheet(4/19 Pages) INTERSIL

Part #	ISL97649BIRZ

Description	TFT-LCD Supply DCP VCOM Amplifier Gate Pulse Modulator RESET

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Manufacturer	INTERSIL [Intersil Corporation]

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4 / 19 page

ISL97649B

4

FN7927.0

December 5, 2011

Absolute Maximum Ratings

Thermal Information

RE, VGHM, GPM_LO, and VGH to GND . . . . . . . . . . . . . . . . . . . -0.3 to +36V

LX, AVDD, POS, OUT to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +18V

Voltage Between GND and PGND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.5V

All Other Pins to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0V

ESD Rating

Human Body Model (Tested per JESD22-A114E) . . . . . . . . . . . . . . . . 2kV

Machine Model (Tested per JESD22-A115-A) . . . . . . . . . . . . . . . . 200V

Charged Device Model (Tested per JESD22-C101). . . . . . . . . . . . . . . 1kV

Thermal Resistance

θJA(°C/W) θJC (°C/W)

4 x 5 QFN Package (Notes 4, 5) . . . . . . . . .

38

4.5

Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C

Functional Junction Temperature . . . . . . . . . . . . . . . . . . . .-40°C to +150°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C

Lead Temperature during Soldering. . . . . . . . . . . . . . . . . . . . . . . . . +260°C

Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

Recommended Operating Conditions

Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5V to 5.5V

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product

reliability and result in failures not covered by warranty.

NOTES:

4.

θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech

Brief TB379.

5. For

θJC, the “case temp” location is the center of the exposed metal pad on the package underside.

Electrical Specifications VIN = ENABLE = 3.3V, AVDD =8V, VON =24V, VOFF = -6V. Boldface limits apply over the operating

temperature range, -40°C to +85°C.

SYMBOL

PARAMETER

TEST CONDITIONS

MIN

(Note 6)

TYP

(Note 7)

MAX

(Note 6)

UNITS

GENERAL

VIN

VIN Supply Voltage Range

2.5

3.3

5.5

V

IS_DIS

VIN Supply Currents when Disabled

VIN<UVLO

390

500

µA

IS

VIN Supply Currents

ENABLE = 3.3V, overdrive AVDD and

VGH

0.7

1.0

mA

IENABLE

ENABLE Pin Current

ENABLE = 0V

0

µA

LOGIC INPUT CHARACTERISTICS - ENABLE, FLK, SCL, SDA, FREQ

VIL

Low Voltage Threshold

0.65

V

VIH

High Voltage Threshold

1.75

V

RIL

Pull-Down Resistor

Enable, FLK, FREQ

0.85

1.25

1.65

MΩ

INTERNAL OSCILLATOR

FOSC

Switching Frequencies

FREQ = low, TA = 25°C

550

600

650

kHz

FREQ = high, TA = 25°C

1100

1200

1300

kHz

AVDD BOOST REGULATOR

ΔAVDD/

ΔIOUT

AVDD Load Regulation

50mA < ILOAD < 250mA

0.2

%

ΔAVDD/

ΔVIN

AVDD Line Regulation

ILOAD = 150mA, 2.5V < VIN < 5.5V

0.15

%

VFB

Feedback Voltage (VFB)ILOAD = 100mA, TA = +25°C

0.792

0.8

0.808

V

IFB

FB Input Bias Current

100

nA

rDS(ON)

Switch ON-resistance

TA = +25°C

180

230

mΩ

ILIM

Switch Current Limit

1.125

1.5

1.875

A

DMAX

Max Duty Cycle

Freq = 1.2MHz

80

90

%

EFF

Freq = 1.2MHz, IAVDD = 100mA

91

%

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