ISL76671

8

Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time

without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be

accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

FN7716.1

December 12, 2011

For additional products, see www.intersil.com/product_tree

Products

Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products

address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.

Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a

complete list of Intersil product families.

For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on

intersil.com: ISL76671

To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff

FITs are available from our website at: http://rel.intersil.com/reports/sear

Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make

sure you have the latest revision.

DATE

REVISION

CHANGE

December 12, 2011

FN7716.1

“Thermal Information” on page 3, changed from:

Pb-Free Reflow Profile (*) ...... see TB487

*Peak temperature during solder reflow +235°C max

To

Pb-Free Reflow Profile (*) ...... see TB477

*Peak temperature during solder reflow +260°C max

“Electrical Specifications” on page 3:

October 19, 2011

FN7716.0

Initial Release