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SIP2804 Datasheet(PDF) 7 Page - Vishay Siliconix |
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SIP2804 Datasheet(HTML) 7 Page - Vishay Siliconix |
7 / 10 page Document Number: 72660 S11-0598-Rev. E, 25-Apr-11 www.vishay.com 7 Vishay Siliconix SiP2800, SiP2801, SiP2802, SiP2803, SiP2804, SiP2805 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 The SiP280X family incorporates internal leading-edge blanking on the CS pin, to keep any spurious voltages on the CS pin from reaching the comparator inputs during the 100 ns interval immediately following the rising edge on OUT (for example, voltages due to capacitive charging currents). Because of this internal leading-edge blanking, many applications require no external RC filter on the CS input. Compared to circuits requiring the use of an external RC filter circuit, leading-edge blanking provides a shorter effective CS to OUT propagation delay. FB FB is the inverting input of the VEA. Internally compared against VREF/2 appearing on the VEA’s non-inverting input. To avoid stability problems, keep lead lengths to FB as short as possible, and use good layout practices to minimize the stray capacitances of components connected to this pin. GND The GND pin is both the reference ground and the power ground for this part. OUT OUT is the output of a high-current driver capable of peak currents in excess of ± 750 mA. OUT is therefore well suited to driving the gates of power MOSFETs. This pin is specifically held low when VCC is below the SiP280X’s UVLO threshold, to ensure a predictable system turn-on. Since the OUT pin is internally connected to a low impedance CMOS buffer, it is capable of rapid rail-to-rail transitions. This output topology also mitigates the effects of undershoot and overshoot. For this reason, external Schottky clamp diodes are generally not required on this pin. RC RC is the oscillator frequency programming pin. FOSC is set by the combination of RT and CT. The charging current for CT is provided through RT, which is normally connected between REF and the SiP280X RC pin. CT then connects from RC to GND. Due to the high impedances encountered in low power control circuits, this connection must be a short and quiet return to GND (preferably by means of a dedicated signal trace, separated from all other circuit functions). The oscillator frequency for the SiP280X family of parts is approximated by the following formulas: For the SiP2800, SiP2801, SiP2802, and SiP2804: •FOSC (1.5)/RTCT For the SiP2803 and SiP2805: •FOSC (1.0)/RTCT Here RT is in ohms and CT is in farads. More accurate formulas for FOSC are: For the SiP2800, SiP2801, SiP2802 and SiP2804: •FOSC = 1/{[(CT + CSTRAY) x RT x 0.652] + [(CT + CSTRAY) x RDISCH x 2.53] + TDELAY} For the SiP2803 and SiP2805: •FOSC = 1/{[(CT + CSTRAY) x RT x 0.93] + [(CT + CSTRAY) x RDISCH x 2.53] + TDELAY} Here RT is in ohms and CT is in farads, RDISCH is the value of the resistor through which CT is discharged (normally an on-chip 130 resistor, unless the circuit is configured with additional external discharge-path resistance), and tDELAY is an inherent internal comparator delay time of 100 ns. The capacitance associated with the RC pin is approximately 7.5 pF, and should be included as a part of CSTRAY. Note that the SiP2801, SiP2804, and SiP2805 have an internal toggle flip-flop at the output of the oscillator, to ensure that the output duty cycle never exceeds 50 %. This divides the frequency appearing at the OUT pin to one-half of the oscillator frequency for these three parts. Values of RT below 10 k are not recommended. Low values of RT cause high circuit operating currents, and very low values will prevent the oscillator from properly discharging CT. REF The reference generator block of the Si280X provides an accurate and stable 4.0 V or 5.0 V (depending upon part number), which is available at this pin of the IC. This voltage is also used internally for other functions on the IC. One of these uses is as the logic power supply for high speed switching logic on the IC; this, and stability concerns, make it important to bypass VREF to GND with a good quality 0.1 µF ceramic capacitor, as close to the part as possible. An electrolytic or tantalum capacitor may be used in addition to the ceramic capacitor. When 1 V < VCC < the UVLO threshold, REF is pulled to ground through a 5 k resistor. Hence, REF can also be used as an output to indicate the part’s VCC status. VCC VCC is the positive power connection for the SiP280X controller IC, and should be the most positive terminal on the part. In normal operation, VCC is powered through a current limiting resistor. The required start-up supply current will generally be on the order of 100 µA with VCC below the UVLO voltage of the SiP280X, and can remain at or below 500 µA total supply current once the part starts switching. To prevent the IC from being damaged by overvoltage conditions, each of the SiP2800 family of parts has an internal clamp (effectively a 13.5 V Zener diode) between VCC and GND. If the part’s VCC pin is current-fed through an appropriate dropping resistor, the VCC pin will never exceed its rated voltage, nor will the device as a whole exceed its rated power dissipation. This does require knowing what the operating current of the IC will be, so that the value of the dropping resistor can be calculated. A good estimate of the actual operating current (ICC) may be made by summing three components: (a) Any external current loading on the VCC or REF pins (b) The operating current required by the IC itself, and (c) The drive current (IDRIVE) required by the external power switch. |
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