ISO3080, ISO3086

ISO3082, ISO3088

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SLOS581D – MAY 2008 – REVISED JANUARY 2011

ENABLE

INPUT

INPUT

(D)

(DE)

Y / A

Z / B

PU

PU

H

H

H

L

PU

PU

L

H

L

H

PU

PU

X

L

hi-Z

hi-Z

PU

PU

X

OPEN

hi-Z

hi-Z

PU

PU

OPEN

H

H

L

PD

PU

X

X

hi-Z

hi-Z

PU

PD

X

X

hi-Z

hi-Z

PD

PD

X

X

hi-Z

hi-Z

(1)

Driver output pins are Y & Z for full-duplex devices and A & B for half-duplex devices.

DIFFERENTIAL INPUT

ENABLE

OUTPUT

(RE)

(R)

PU

PU

–0.01 V

L

H

PU

PU

L

?

PU

PU

L

L

PU

PU

X

H

hi-Z

PU

PU

X

OPEN

hi-Z

PU

PU

Open circuit

L

H

PU

PU

Short Circuit

L

H

PU

PU

Idle (terminated) bus

L

H

PD

PU

X

X

hi-Z

PU

PD

X

L

H

(1)

PU = Powered Up; PD = Powered Down; H = Logic High; L= Logic Low; X = Irrelevant, hi-Z = High

Impedance (off), ? = Indeterminate

PACKAGE CHARACTERISTICS

over recommended operating conditions (unless otherwise noted)

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Shortest terminal to terminal distance through

L(I01)

Minimum air gap (Clearance)

8.34

mm

air

Shortest terminal to terminal distance across

L(I02)

Minimum external tracking (Creepage)

8.1

mm

the package surface

Tracking resistance (Comparative Tracking

CTI

DIN IEC 60112 / VDE 0303 Part 1

≥175

V

Index)

Minimum Internal Gap (Internal Clearance)

Distance through the insulation

0.008

mm

Isolation resistance

side of the barrier tied together creating a

Ω

two-terminal device

Barrier capacitance Input to output

VI = 0.4 sin (4E6pt)

2

pF

Input capacitance to ground

VI = 0.4 sin (4E6pt)

2

pF

(1)

Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care

should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on

the printed circuit board do not reduce this distance.

Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation

Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.

Copyright © 2008–2011, Texas Instruments Incorporated

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Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088