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SS30 Datasheet(PDF) 7 Page - Sanyo Semicon Device
SANYO [Sanyo Semicon Device]
SS30 Datasheet(HTML) 7 Page - Sanyo Semicon Device
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SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using
products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd.
products described or contained herein.
SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all
semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or
malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise
to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt
safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not
limited to protective circuits and error prevention circuits for safe design, redundant design, and structural
Upon using the technical information or products described herein, neither warranty nor license shall be granted
with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third
party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's
intellctual property rights which has resulted from the use of the technical information and products mentioned
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed
for volume production.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the
SANYO Semiconductor Co.,Ltd. product that you intend to use.
In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are
controlled under any of applicable local export control laws and regulations, such products may require the
export license from the authorities concerned in accordance with the above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written consent of SANYO Semiconductor Co.,Ltd.
8. Charge Pump Circuit
The SS30 n-channel DMOS output structure allows it to provide a charge pump based voltage step-up circuit. A
voltage 2 times the VCC voltage can be acquired by inserting capacitors (recommended value: 0.1
μF or larger)
between the CP pin (pin 14) and CPC pin (pin 15). Note that this circuit is designed so that the stepped-up voltage
(VG) is clamped at about 9.5VDC. A larger capacitor must be used between the VG pin (pin 12) and ground if the
ripple on the stepped-up voltage (VG) results in VG exceeding 10V (VG max).
Observe the following points if the VG voltage is supplied from external circuits.
(1) The VG voltage supplied from the external circuits must not exceed the absolute maximum rating VG max.
(2) The capacitors between the CP pin (pin 14) and CPC pin (pin 15) are not required.
(3) Observe the correct sequence when turning the power supply on. Apply the VG voltage after first turning the
VCC voltage on, and cancel the VG voltage application before turning the VCC off.
(4) There is an IC-internal diode between the VCC and VG pins. Therefore, supply voltages such that VCC > VG
must never be applied to this IC.
9. Notes on PCB Pattern Design
The SS30 is a system driver IC implemented using the Bi-CMOS process; the IC chip includes bipolar circuits, MOS
logic circuits, and MOS drive circuits. As a result, extreme care is required with respect to the pattern layout when
designing application circuits.
(1) SGND/SUBGND and VCC/VM wiring layout
Please connect the SGND pin and the SUBGND pin by the beeline. Please connect the VCC pin and the VM pin by
the beeline similarly.
Insert a capacitor (recommended value: 1
μF or larger) as near as possible to the pin between the power pin VCC
(pin 1)/VM (pin 2) and SGND pin (pin 7).
(2) Positioning the external components
The external components that are connected to SGND (pin 7) must be connected with lines that are as short as
External components connected between IC pins must be placed as near to the pins as possible.
This catalog provides information as of December, 2010. Specifications and information herein are subject
to change without notice.
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