Document Number: 73320

S11-0303-Rev. D, 28-Feb-11

www.vishay.com

9

Vishay Siliconix

DG3537, DG3538, DG3539, DG3540

PACKAGE OUTLINE

MICRO FOOT: 8 BUMP (3 x 3, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)

Notes (Unless Otherwise Specified):

a. Bump is Lead (Pb)-free Sn/Ag/Cu.

b. Non-solder mask defined copper landing pad.

c. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.

Notes:

a. Use millimeters as the primary measurement.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

Index-Bump A1

Note c

Top Side (Die Back)

XXX

3540

Recommended Land Pattern

0.5

0.5

8 x Ø 0.150

Note b

Solder Mask Ø

Bump

Note a

21

A

B

e

D

A

S

S

E

Silicon

C

3

b Diameter

e

e

e

Inches

Dim.

Min.

Max.

Min.

Max.

A

0.688

0.753

0.0271

0.0296

0.218

0.258

0.0086

0.0102

0.470

0.495

0.0185

0.0195

b

0.306

0.346

0.0120

0.0136

D

1.480

1.520

0.0583

0.0598

E

1.480

1.520

0.0583

0.0598

e

0.5 BASIC

0.0197 BASIC

S

0.230

0.270

0.0091

0.0106