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LNK624DG Datasheet(PDF) 11 Page - Power Integrations, Inc. |
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LNK624DG Datasheet(HTML) 11 Page - Power Integrations, Inc. |
11 / 18 page Rev. E 09/09 11 LNK623-626 www.powerint.com Parameter Symbol Conditions SOURCE = 0 V; T J = -40 to 125 °C (Unless Otherwise Specified) Min Typ Max Units Control Functions Output Frequency f OSC T J = 25 °C, VFB = VFBth LNK623/6 93 100 106 kHz Frequency Jitter Peak-Peak Jitter Compared to Average Frequency, T J = 25 °C ±7 % Ratio of Output Frequency at Auto-RST f OSC(AR) T J = 25 °C Relative to f OSC (See Note 3) 80 % Maximum Duty Cycle DC MAX (Note 2,3) T J = 25 °C 54 % Feedback Pin Voltage V FBth T J = 25 °C See Figure 15, C BP = 1 μF LNK623-624P 1.815 1.840 1.865 V LNK623-624D 1.855 1.880 1.905 LNK625P, LNK625D 1.835 1.860 1.885 LNK626P, LNK626D 1.775 1.800 1.825 Feedback Pin Voltage Temperature Coefficient TC VFB -0.01 %/°C Feedback Pin Voltage at Turn-Off Threshold V FB(AR) 1.45 V Power Coefficient I2f I2f = I2 LIMIT(TYP) × fOSC(TYP) LNK623/6P T J = 25 °C 0.9 × I2fI2f 1.17 × I2f A2Hz I2f = I2 LIMIT(TYP) × fOSC(TYP) LNK623/6D T J = 25 °C 0.9 × I2fI2f 1.21 × I2f Absolute Maximum Ratings(1,4) DRAIN Voltage ........................................... ..............-0.3 V to 700 V DRAIN Peak Current: LNK623 ......................... 400 (600) mA(4) LNK624 ......................... 400 (600) mA(4) LNK625 ..........................528 (790) mA(4) LNK626 ........................720 (1080) mA(4) Peak Negative Pulsed DRAIN Current ................... ...... -100 mA(2) Feedback Voltage ................................................. ....... -0.3 V to 9 V Feedback Current ............................................................... 100 mA BYPASS Pin Voltage ..................................... ............. -0.3 V to 9 V Storage Temperature ........................................... -65 °C to 150 °C Operating Junction Temperature.........................-40 °C to 150 °C Lead Temperature(3) .................................................................260 °C Notes: 1. All voltages referenced to SOURCE, T A = 25 °C. 2. Duration not to exceed 2 msec. 3. 1/16 in. from case for 5 seconds. 4. The higher peak DRAIN current is allowed while the DRAIN voltage is simultaneously less than 400 V. 5. Maximum ratings specified may be applied, one at a time without causing permanent damage to the product. Exposure to Absolute Maximum ratings for extended periods of time may affect product reliability. Thermal Resistance Thermal Resistance: P Package: (θ JA) .................................... 70 °C/W (2); 60 °C/W(3) (θ JC) (1) ............................................... ......... 11 °C/W D Package: (θ JA .....................................100 °C/W (2); 80 °C/W(3) (θ JC) (1) .......................... ...........................30 °C/W Notes: 1. Measured on pin 8 (SOURCE) close to plastic interface. 2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad. 3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad. |
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