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LNK454DG-TL Datasheet(PDF) 11 Page - Power Integrations, Inc. |
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LNK454DG-TL Datasheet(HTML) 11 Page - Power Integrations, Inc. |
11 / 20 page Rev. A 11/01/10 11 LNK454/456-458/460 www.powerint.com Parameter Symbol Conditions SOURCE = 0 V; T J = -40 to +125 °C (Unless Otherwise Specified) Min Typ Max Units Control Functions Maximum Output Frequency f MAX T J = 25 °C Average 110 122 134 kHz Peak-Peak Jitter 6 % Minimum Output Frequency f MIN T J = 25 °C Average 25.8 28.7 31.6 kHz Peak-Peak Jitter 6 % Maximum Switch ON-Time t ON(MAX) T J = 25 °C 5.74 µs Minimum Switch ON-Time t ON(MIN) T J = 25 °C 1.2 µs Maximum Duty Cycle DC MAX 70 % FEEDBACK Pin Voltage V FB T J = 25 °C Non-dimming (full power) operation 280 290 300 mV FEEDBACK Pin Voltage Triggering Cycle Skipping Mode V FB(SK) Non-dimming (full power) operation 520 mV FEEDBACK Pin Voltage for IC Auto-Restart V FB(AR) 2 V Feedback Pull-up Current I FB -1.3 -1.0 -0.7 µA Absolute Maximum Ratings(1,4) DRAIN Pin Peak Current(5): LNK454 ............... 400 mA (750 mA) LNK456 ..............850 mA (1450 mA) LNK457 ........... 1350 mA (2000 mA) LNK458 ............1750 mA (2650 mA) LNK460 ............2700 mA (5100 mA) DRAIN Pin Voltage ………………………............. -0.3 V to 725 V FEEDBACK Pin Voltage ……………………… ............ -0.3 to 9 V BYPASS Pin Voltage ……………………… ................. -0.3 to 9 V Lead Temperature(3) ................................................................260 °C Storage Temperature …………………................... -65 to 150 °C Operating Junction Temperature(2).........................-40 to 150 °C Notes: 1. All voltages referenced to SOURCE, T A = 25 °C. 2. Normally limited by internal circuitry. 3. 1/16 in. from case for 5 seconds. 4. The Absolute Maximum Ratings specified may be applied, one at a time without causing permanent damage to the product. Exposure to Absolute Maximum Ratings for extended periods of time may affect product reliability. 5. The higher peak Drain current (in parentheses) is allowed while the Drain voltage is simultaneously less than 400 V. Thermal Resistance Thermal Resistance: D (SO-8C) Package: ( q JA) .................................. 100 °C/W (1) , 80 °C/W(2) ( q JC) ........................................................ 30 °C/W (3) K (eSOP) Package: ( q JA) .................................... 69 °C/W (1) , 49 °C/W(2) ( q JC) ...........................................................2 °C/W (4) V (eDIP) Package: ( q JA) .................................... 76 °C/W (1) , 64 °C/W(2) ( q JC) ...........................................................2 °C/W (4) Notes: 1. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610g/m2) copper clad, with no external heat sink attached. 2. Soldered to 1 sq. in. (645 mm2), 2 oz. (610g/m2) copper clad, with no external heat sink attached. 3. Measured on the SOURCE pin close to plastic interface. 4. Measured at the surface of exposed pad. |
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