OPA314

OPA2314

OPA4314

www.ti.com

SBOS563B

– MAY 2011 – REVISED DECEMBER 2011

THERMAL INFORMATION: OPA314

OPA314

DBV (SOT23)

DCK (SC70)

UNITS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

228.5

281.4

Junction-to-case(top) thermal resistance

99.1

91.6

Junction-to-board thermal resistance

54.6

59.6

°C/W

Junction-to-top characterization parameter

7.7

1.5

Junction-to-board characterization parameter

53.8

58.8

Junction-to-case(bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA2314

OPA2314

D (SO)

DGK (MSOP)

DRB (DFN)

UNITS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

138.4

191.2

53.8

Junction-to-case(top) thermal resistance

89.5

61.9

69.2

Junction-to-board thermal resistance

78.6

111.9

20.1

°C/W

Junction-to-top characterization parameter

29.9

5.1

3.8

Junction-to-board characterization parameter

78.1

110.2

20.0

Junction-to-case(bottom) thermal resistance

N/A

N/A

11.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA4314

OPA4314

PW (TSSOP)

UNITS

14 PINS

Junction-to-ambient thermal resistance

121.0

Junction-to-case(top) thermal resistance

49.4

Junction-to-board thermal resistance

62.8

°C/W

Junction-to-top characterization parameter

5.9

Junction-to-board characterization parameter

62.2

Junction-to-case(bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright

© 2011, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Link(s): OPA314 OPA2314 OPA4314