Micrel, Inc.

SY54017R

March 2008

4

M9999-033108-A

Absolute Maximum Ratings

(1)

Source or sink current on VT pin .................±100mA

Input Current

Source or sink current on (IN, /IN) .................±50mA

Maximum operating Junction Temperature .......... 125°C

Lead Temperature (soldering, 20sec.) .................. 260°C

Operating Ratings

(2)

Package Thermal Resistance

(3)

MLF

®

Still-air (

θ

Junction-to-board (

ψ

DC Electrical Characteristics

(4)

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Voltage Range

2.375

1.14

1.7

2.5

1.2

1.8

2.625

1.26

1.9

V

V

V

Power Supply Current

22

32

mA

Power Supply Current

16

21

mA

Input Resistance

45

50

55

Ω

Differential Input Resistance

(IN-to-/IN)

90

100

110

Ω

Input HIGH Voltage

(IN, /IN)

Input LOW Voltage

(IN, /IN)

IN, /IN

1.2

0.2

V

V

Input HIGH Voltage

(IN, /IN)

Input LOW Voltage

(IN, /IN)

IN, /IN

1.14

0.66

V

V

Input Voltage Swing

(IN, /IN)

see Figure 3a

0.1

1.0

V

Differential Input Voltage Swing

(|IN - /IN|)

see Figure 3b

0.2

2.0

V

Input Voltage Threshold that

Triggers FSI

30

100

mV

1.28

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not

implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for

extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.

ψ

values are determined for a 4-layer board in still-air number, unless otherwise stated.

4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.