3

3 - 97

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Harmonics of LO

LO Freq. (GHz)

nLO Spur at RF Port

1234

3.5

40

40

54

50

4.5

43

45

58

53

5.5

51

57

48

67

6.5

59

63

64

56

7.5

48

66

64

62

8.5

44

65

60

67

LO = +15 dBm

Values in dBc below input LO level measured at RF Port.

MxN Spurious Outputs

nLO

mRF

0

1234

0xx

-11

32

23

51

132042

51

66

289

62

74

65

89

3

8989898289

4

8989898989

RF = 5.6 GHz @ -10 dBm

LO = 5.5 GHz @ +15 dBm

Data taken without IF hybrid

All values in dBc below IF power level

Absolute Maximum Ratings

RF / IF Input

+20 dBm

LO Drive

+27 dBm

Channel Temperature

150°C

Continuous Pdiss (T=85°C)

(derate 9.7 mW/°C above 85°C)

631 mW

Thermal Resistance (R

TH

)

(junction to die bottom)

103 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 deg °C

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS .004” SQUARE

4. BACKSIDE METALIZATION: GOLD

5. BOND PAD METALIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. CONNECTION NOT REQUIRED FOR

UNLABELED BOND PADS.

8. OVERALL DIE SIZE ±.002”

Standard

Alternate

GP-2 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC525

v01.1007

GaAs MMIC I/Q MIXER

4.0 - 8.5 GHz