For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

8

8 - 107

Outline Drawing

Absolute Maximum Ratings

Collector Bias Voltage (Vcc)

+6 Vdc

RF Input Power (RFIN)(Vcc = +4.2 Vdc)

+5 dBm

Junction Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 9.5 mW/°C above 85 °C)

0.615 W

Thermal Resistance

(junction to lead)

105.6 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

ESD Sensitivity (HBM)

Class 1C

SiGe HBT GAIN BLOCK

MMIC AMPLIFIER, DC - 4 GHz

v05.0710

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC478ST89

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H478

XXXX

HMC478ST89E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H478

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

NOTES:

1. PACKAGE BODY MATERIAL:

MOLDING COMPOUND MP-180S OR EQUIVALENT.

2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING.

3. LEAD PLATING: 100% MATTE TIN.

4. DIMENSIONS ARE IN INCHES [MILLIMETERS]

5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.