( Ta = 25˚C)

Parameter

Symbol

Input

Forward voltage

Reverse current

Output

On-state voltage

Holding current

Critical rate of rise of com-

Transfer

charac-

teristics

Minimum trigger current

Isolation resistance

Turn-on time

Turn-off time

Thermal resistance ( Between junction and case )

Thermal resistance ( Between junction and ambience)

Conditions

Ω

AC = 50Hz

MIN.

TYP.

MAX.

Unit

-

1.2

1.4

V

--

A

--

A

-

-

1.5

-

-

-

35

mA

30

-

-

V/

µ s

5-

-

V/

µ s

--

5

mA

--

Ω

1ms

-

-

-

-

10

ms

-

4.5

-

˚C/W

-

-

-

40

-

˚C/W

Repetitive peak OFF-state current

Critical rate of rise of OFF-state voltage

mutating OFF-state voltage

2

-25

0

1

75

25

0

50

125

100

9

3

4

5

6

7

8

10

(2)

(4)

(6)

(5)

(3)

(1)

carried out.

conductive silicone grease on the heat sink

the device at the center of the Al heat sink

( 5) With heat sink ( 50 x 50 x 2 mm Al plate )

( 4) With heat sink ( 75 x 75 x 2 mm Al plate )

( 3) With heat sink ( 100 x 100 x 2 mm Al plate )

( 2) With heat sink ( 200 x 200 x 2 mm Al plate )

( 6) Without heat sink

( 1) With infinite heat sink

Fig. 1 RMS ON-state Current vs.

Ambient Temperature

S102S03/S202S03

s Electro-optical Characteristics

mounting plate. Forcible cooling shall not be

with a torque of 0.4N • m and apply thermal

dV/dt

DC = 500V, 40 to 60 % RH

( Note) With the Al heat sink set up vertically, tighten