Electronic Components Datasheet Search |
|
LPC1343FHN33 Datasheet(PDF) 67 Page - NXP Semiconductors |
|
LPC1343FHN33 Datasheet(HTML) 67 Page - NXP Semiconductors |
67 / 73 page LPC1311_13_42_43 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 20 June 2011 67 of 73 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Fig 41. Reflow soldering of the HVQFN33 package Footprint information for reflow soldering of HVQFN33 package 001aao134 occupied area solder land solder resist solder land plus solder paste solder paste deposit Dimensions in mm Remark: Stencil thickness: 0.125 mm e = 0.65 evia = 4.25 OwDtot = 5.10 OA PID = 7.25 PA+OA OID = 8.20 OA 0.20 SR chamfer (4×) W = 0.30 CU evia = 2.40 LbD = 5.80 CU LaD = 7.95 CU DHS = 4.85 CU 4.55 SR B-side (A-side fully covered) number of vias: 20 Solder resist covered via 0.30 PH 0.60 SR cover 0.60 CU SDhtot = 2.70 SP 0.45 DM SPD = 1.00 SP GapD = 0.70 SP |
Similar Part No. - LPC1343FHN33 |
|
Similar Description - LPC1343FHN33 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |