DRV8301

SLOS719

– AUGUST 2011

www.ti.com

PIN FUNCTIONS (continued)

PIN

DESCRIPTION

NAME

NO.

BST_C

38

P

Bootstrap cap pin for half-bridge C

SL_B

39

I

SH_B.

GL_B

40

O

Gate drive output for Low-Side MOSFET, half-bridge B

SH_B

41

I

PVDD1.

GH_B

42

O

Gate drive output for High-Side MOSFET, half-bridge B

BST_B

43

P

Bootstrap cap pin for half-bridge B

SL_A

44

I

SH_A.

GL_A

45

O

Gate drive output for Low-Side MOSFET, half-bridge A

SH_A

46

I

PVDD1.

GH_A

47

O

Gate drive output for High-Side MOSFET, half-bridge A

BST_A

48

P

Bootstrap cap pin for half-bridge A

VDD_SPI

49

I

SPI supply pin to support 3.3V or 5V logic. Connect to either 3.3V or 5V.

PH

50, 51

O

The source of the internal high side MOSFET of buck converter

BST_BK

52

P

Bootstrap cap pin for buck converter

PVDD2

53,54

P

Power supply pin for buck converter, PVDD2 cap should connect to GND.

EN_BUCK

55

I

Enable buck converter. Internal pull-up current source. Pull below 1.2V to disable. Float to enable.

Adjust the input undervoltage lockout with two resistors

SS_TR

56

I

Buck soft-start and tracking. An external capacitor connected to this pin sets the output rise time. Since

the voltage on this pin overrides the internal reference, it can be used for tracking and sequencing. Cap

should connect to GND

GND

57

P

GND pin. The exposed power pad must be electrically connected to ground plane through soldering to

(POWER

PCB for proper operation and connected to bottom side of PCB through vias for better thermal

PAD)

spreading.

4

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