Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF Download HTML

AS5163-HTSP Datasheet(PDF) 4 Page - ams AG

Part No. AS5163-HTSP
Description  12-Bit Automotive Angle Position Sensor
Download  36 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  AMSCO [ams AG]
Direct Link  http://www.ams.com
Logo AMSCO - ams AG

AS5163-HTSP Datasheet(HTML) 4 Page - ams AG

  AS5163-HTSP Datasheet HTML 1Page - ams AG AS5163-HTSP Datasheet HTML 2Page - ams AG AS5163-HTSP Datasheet HTML 3Page - ams AG AS5163-HTSP Datasheet HTML 4Page - ams AG AS5163-HTSP Datasheet HTML 5Page - ams AG AS5163-HTSP Datasheet HTML 6Page - ams AG AS5163-HTSP Datasheet HTML 7Page - ams AG AS5163-HTSP Datasheet HTML 8Page - ams AG AS5163-HTSP Datasheet HTML 9Page - ams AG Next Button
Zoom Inzoom in Zoom Outzoom out
 4 / 36 page
background image
www.austriamicrosystems.com/AS5163
Revision 2.7
4 - 36
AS5163
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD
DC supply voltage at pin VDD
Overvoltage
-18
27
V
No operation
VOUT
Output voltage OUT
-0.3
27
V
permanent
VKDOWN
Output voltage KDOWN
-0.3
27
V
VDD3
DC supply voltage at pin VDD3
-0.3
5
V
VDD5
DC supply voltage at pin VDD5
-0.3
7
V
Iscr
Input current (latchup immunity)
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge
ESD
Electrostatic discharge
±4
kV
Norm: MIL 883 E method 3015
This value is applicable to pins VDD, GND, OUT,
and KDOWN.
All other pins ±2 kV.
Temperature Ranges and Storage Conditions
Tstrg
Storage temperature
-55
+150
ºC
Min -67ºF; Max +257ºF
TBody
Body temperature (Lead-free package)
260
ºC
t=20 to 40s,
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
H
Humidity non-condensing
585
%
Moisture Sensitive Level
3
Represents a maximum floor life time of 168h


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30  31  32  33  34  35  36 


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn