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SFC05-4 Datasheet(PDF) 4 Page - Semtech Corporation

Part No. SFC05-4
Description  CSP TVS Flip Chip TVS Diode Array
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Maker  SEMTECH [Semtech Corporation]
Homepage  http://www.semtech.com
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SFC05-4 Datasheet(HTML) 4 Page - Semtech Corporation

   
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ã 2000 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC05-4
PRELIMINARY
Device Connection Options
The SFC05-4 has solder bumps located in a 3 x 2
matrix layout on the active side of the device. The
bumps are designated by the numbers 1 - 3 along the
horizontal axis and letters A - B along the vertical axis.
The lines to be protected are connected at bumps A1,
B1, A3, and B3. Bumps A2 & B2 are connected to
ground. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces.
Wafer Level CSP TVS
CSP TVS devices are wafer level chip scale packages.
They eliminate external plastic packages and leads and
thus result in a significant board space savings. Manu-
facturing costs are minimized since they do not require
an intermediate level interconnect or interposer layer
for reliable operation. They are compatible with cur-
rent pick and place equipment further reducing manu-
facturing costs. Certain precautions and design
considerations have to be observed however for
maximum solder joint reliability. These include solder
pad definition, board finish, and assembly parameters.
Printed Circuit Board Mounting
Non-solder mask defined (NSMD) land patterns are
recommended for mounting the SFC05-4. Solder
mask defined (SMD) pads produce stress points near
the solder mask on the PCB side that can result in
solder joint cracking when exposed to extreme fatigue
conditions. The recommended pad size is 0.200 ± 10
mm with a solder mask opening of 0.350 ± 0.025 mm.
Grid Courtyard
The recommended grid placement courtyard is 1.3 x
1.8 mm. The grid courtyard is intended to encompass
the land pattern and the component body that is
centered in the land pattern. When placing parts on a
PCB, the highest recommended density is when one
courtyard touches another.
Applications Information
Device Schematic & Pin Configuration
Layout Example
NSMD Package Footprint
A
B
1
23
To Protected IC
To Protected IC
To Connector
Ground


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