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MSP430F413IRTDR Datasheet(PDF) 36 Page - Texas Instruments

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Part No. MSP430F413IRTDR
Description  MIXED SIGNAL MICROCONTROLLER
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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MSP430F413IRTDR Datasheet(HTML) 36 Page - Texas Instruments

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MSP430x41x
MIXED SIGNAL MICROCONTROLLER
SLAS340J − MAY 2001 − REVISED DECEMBER 2008
36
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
crystal oscillator, LFXT1 oscillator (see Notes 1 and 2)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
OSCCAPx = 0h
0
C
Integrated load capacitance
OSCCAPx = 1h
2 2 V/3 V
10
pF
CXIN
Integrated load capacitance
OSCCAPx = 2h
2.2 V/3 V
14
pF
OSCCAPx = 3h
18
OSCCAPx = 0h
0
C
Integrated load capacitance
OSCCAPx = 1h
2 2 V/3 V
10
pF
CXOUT
Integrated load capacitance
OSCCAPx = 2h
2.2 V/3 V
14
pF
OSCCAPx = 3h
18
VIL
Input levels at XIN
see Note 3
2.2 V/3 V
VSS
0.2
×VCC
V
VIH
Input levels at XIN
see Note 3
2.2 V/3 V
0.8
×VCC
VCC
V
NOTES:
1. The parasitic capacitance from the package and board may be estimated to be 2pF. The effective load capacitor for the crystal is
(CXIN × CXOUT) / (CXIN + CXOUT). It is independent of XTS_FLL.
2. To improve EMI on the low-power LFXT1 oscillator, particularly in the LF mode (32 kHz), the following guidelines must be
observed:
• Keep the trace between the MSP430x41x and the crystal as short as possible.
• Design a good ground plane around oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to XIN an XOUT pins.
• Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
• Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation.
This signal is no longer required for the serial programming adapter.
3. Applies only when using an external logic-level clock source. XTS_FLL must be set. Not applicable when using a crystal or resonator.
4. External capacitance is recommended for precision real-time clock applications; OSCCAPx = 0h.


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