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ADS1118IDGST Datasheet(PDF) 4 Page - Texas Instruments

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Part No. ADS1118IDGST
Description  Ultra-Small, Low-Power, SPI-Compatible, 16-Bit Analog-to-Digital Converter and Temperature Sensor with Internal Reference
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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ADS1118IDGST Datasheet(HTML) 4 Page - Texas Instruments

 
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ADS1118
SBAS457A
– OCTOBER 2010 – REVISED JULY 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Maximum/minimum specifications at
–40°C to +125°C, VDD = 3.3V, data rate = 8SPS, and full-scale (FS) = ±2.048V, unless
otherwise noted. Typical values are at +25
°C, VDD = 3.3V, data rate = 8SPS, and full-scale (FS) = ±2.048V, unless otherwise
noted.
ADS1118
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUT/OUTPUT
Logic level
VIH
0.7VDD
VDD
V
VIL
GND
0.2VDD
V
VOH
IOH = 1mA
0.8VDD
V
VOL
IOL = 1mA
GND
0.2VDD
V
Input leakage
IH
VIH = 5.5V
±10
μA
IL
VIL = GND
±10
μA
POWER-SUPPLY REQUIREMENTS
Power-supply voltage
2
5.5
V
Power-down current at +25
°C
0.5
2
μA
Power-down current up to +125
°C
5
μA
Supply current
Operating current at +25
°C
150
200
μA
Operating current up to +125
°C
300
μA
VDD = 5.0V
0.9
mW
Power dissipation
VDD = 3.3V
0.5
mW
VDD = 2.0V
0.3
mW
TEMPERATURE
Storage temperature
–60
+150
°C
Specified temperature
–40
+125
°C
THERMAL INFORMATION
ADS1118
THERMAL METRIC(1)
DGS
UNITS
10 PINS
θJA
Junction-to-ambient thermal resistance
186.8
θJCtop
Junction-to-case (top) thermal resistance
51.5
θJB
Junction-to-board thermal resistance
108.4
°C/W
ψJT
Junction-to-top characterization parameter
2.7
ψJB
Junction-to-board characterization parameter
106.5
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Copyright
© 2010–2011, Texas Instruments Incorporated


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