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PCF8582C-2 Datasheet(PDF) 18 Page - NXP Semiconductors |
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PCF8582C-2 Datasheet(HTML) 18 Page - NXP Semiconductors |
18 / 21 page Philips Semiconductors PCF8582C-2 256 × 8-bit CMOS EEPROM with I2C-bus interface Product data Rev. 04 — 25 October 2004 18 of 21 9397 750 14222 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 15.4 Package related soldering information [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [4] Hot bar soldering or manual soldering is suitable for PMFP packages. [5] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. [6] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [7] If wave soldering is considered, then the package must be placed at a 45 ° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [8] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [9] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Table 10: Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Package[1] Soldering method Wave Reflow[2] Dipping Through-hole mount DBS, DIP, HDIP, RDBS, SDIP, SIL suitable[3] − suitable Through-hole- surface mount PMFP[4] not suitable not suitable − Surface mount BGA, LBGA, LFBGA, SQFP, SSOP-T[5], TFBGA, VFBGA not suitable suitable − DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable[6] suitable − PLCC[7], SO, SOJ suitable suitable − LQFP, QFP, TQFP not recommended[7][8] suitable − SSOP, TSSOP, VSO, VSSOP not recommended[9] suitable − |
Similar Part No. - PCF8582C-2_04 |
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Similar Description - PCF8582C-2_04 |
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