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MAXQ1740 Datasheet(PDF) 3 Page - Maxim Integrated Products

Part No. MAXQ1740
Description  Magnetic Card Reader Security Microcontroller Optimized for C-Compiler
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAXQ1740 Datasheet(HTML) 3 Page - Maxim Integrated Products

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MAXQ1740
Magnetic Card Reader Security Microcontroller
ABRIDGED DATA SHEET
Applications Information
The low-power, high-performance RISC architecture of
this device makes it an excellent fit for many portable or
battery-powered applications requiring security.
Grounds and Bypassing
Careful PCB layout significantly minimizes system-level
digital noise that could interact with the microcontroller or
peripheral components. The use of multilayer boards is
essential to allow the use of dedicated power planes. The
area under any digital components should be a continu-
ous ground plane if possible. Keep any bypass capacitor
leads short for best noise rejection and place the capaci-
tors as close as possible to the leads of the device.
CMOS design guidelines for any semiconductor require
that no pin be taken above VDD or below GND. Violation
of this guideline can result in a hard failure (damage to
the silicon inside the device) or a soft failure (unintentional
modification of memory contents). Voltage spikes above
or below the device’s absolute maximum ratings can
potentially cause a catastrophic latchup of the device.
Microcontrollers commonly experience negative volt-
age spikes through either their power pins or general-
purpose I/O pins. Negative voltage spikes on power pins
are especially problematic as they directly couple to the
internal power buses. Devices such as keypads can con-
duct electrostatic discharges directly into the microcon-
troller and seriously damage the device. System design-
ers must protect components against these transients
that can corrupt system memory.
Additional Documentation
Designers must have the following documents to fully use
all the features of this device. This data sheet contains
pin descriptions, feature overviews, and electrical speci-
fications. Errata sheets contain deviations from published
specifications. The user’s guides offer detailed informa-
tion about device features and operation.
• This MAXQ1740 data sheet, which contains electrical/
timing specifications and pin descriptions.
• The revision-specific MAXQ1740 errata sheet.
• The MAXQ1740 User’s Guide, which contains detailed
information on core features and operation, including
programming.
Development and
Technical Support
A variety of highly versatile, affordably-priced develop-
ment tools for this microcontroller are available from
Maxim and third-party suppliers, including:
• Compilers
• In-circuit emulators
• Integrated development environments (IDEs)
A partial list of development tool vendors can be found at
www.maxim-ic.com/MAXQ�tools.
For technical support, go to https://support.maxim-ic.
com/micro.
Ordering Information
Package Information
For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages.Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains
to the package regardless of RoHS status.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Notetoreaders: This document is an abridged version of the full data sheet. To request the full data sheet, go to
www.maxim-ic.com/MAXQ1740 and click on RequestFullDataSheet.
PART
TEMPRANGE
OPERATING
VOLTAGE(V)
FLASHMEMORY
(KB)
DATAMEMORY
(KB)
PIN-PACKAGE
MAXQ1740-FBX+
0NC to +70NC
1.70 to 3.6
16
1
28 TQFN-EP*
MAXQ1740-DNS+
0NC to +70NC
1.70 to 3.6
16
1
Bare die
PACKAGETYPE
PACKAGECODE
OUTLINENO.
LANDPATTERNNO.
28 TQFN-EP
T2844+1
21-0139
90-0035


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