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CY62137EV30 Datasheet(PDF) 5 Page - Cypress Semiconductor |
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CY62137EV30 Datasheet(HTML) 5 Page - Cypress Semiconductor |
5 / 16 page CY62137EV30 MoBL® Document #: 38-05443 Rev. *E Page 5 of 16 Capacitance Parameter [9] Description Test Conditions Max Unit CIN Input capacitance TA = 25 °C, f = 1 MHz, VCC = VCC(typ) 10 pF COUT Output capacitance 10 pF Thermal Resistance Parameter [9] Description Test Conditions 48-ball BGA 44-pin TSOP II Unit JA Thermal resistance (junction to ambient) Still air, soldered on a 3 × 4.5 inch, two-layer printed circuit board 75 77 C/W JC Thermal resistance (junction to case) 10 13 C/W AC Test Loads and Waveforms Figure 3. AC Test Loads and Waveforms VCC VCC OUTPUT R2 30 pF INCLUDING JIG AND SCOPE GND 90% 10% 90% 10% Rise Time = 1 V/ns Fall Time = 1 V/ns OUTPUT V Equivalent to: THÉVENIN EQUIVALENT ALL INPUT PULSES RTH R1 Parameters 2.50 V 3.0 V Unit R1 16667 1103 R2 15385 1554 RTH 8000 645 VTH 1.20 1.75 V Note 9. Tested initially and after any design or process changes that may affect these parameters. [+] Feedback |
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