Document #: 38-05443 Rev. *E

Page 5 of 16

Capacitance

Parameter [9]

Description

Test Conditions

Max

Unit

Input capacitance

10

pF

Output capacitance

10

pF

Thermal Resistance

Parameter [9]

Description

Test Conditions

48-ball BGA 44-pin TSOP II Unit

Thermal resistance

(junction to ambient)

Still air, soldered on a 3 × 4.5 inch,

two-layer printed circuit board

75

77

C/W

Thermal resistance

(junction to case)

10

13

C/W

AC Test Loads and Waveforms

Figure 3. AC Test Loads and Waveforms

OUTPUT

R2

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT

V

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

R1

Parameters

2.50 V

3.0 V

Unit

R1

16667

1103



R2

15385

1554



8000

645



1.20

1.75

V

Note

9. Tested initially and after any design or process changes that may affect these parameters.

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